Job Description

Wafer Back-End Packaging Technology Lead

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible a Better Future.

Salary: $148,000.00 - $203,500.00 Location: Austin, TX

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.

We are looking for a dynamic and experienced candidate in wafer back-end packaging technology to drive wafer level R&D packaging activities. This individual will lead projects across, but not limited to technology building blocks such as Hybrid Bonding technology, Through silicon via (TSV), redistribution layer (RDL), towards enabling 2.5 and 3D package architectures.

Key Responsibilities

• On-site Process Integration for novel wafer level assembly flows including but not limited to hybrid bonding, TSV and RDL technology.
• Works with business unit in technology development and transfer to customers including customized process development.
• Plans unit process sequence based on customer requirements.
• Negotiates process specifications and service offerings with customers.
• Takes ownership of delivering the required solution to the customers that meets specification.
• Serves as the customer expert across a broad range of products.
• Plays a key role in defining product strategy and identifying gaps.
• Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
• Takes the lead in positioning new technologies to customers utilizing technical information from division.
• Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs.
• Makes executive level presentations.
• Resolves significantly complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes.
• Create a mechanism to communicate issues, track progress and pull resources from multiple BU's and/or functions.
• Uses sound statistical techniques and problem solving methodologies like DOEs (Design of Experiment) to quickly determine root cause and action plans.
• Communicates learnings from this portion to rest-of-world to strengthen the product packages
• Provides oversight of customer demos, including defining demo conditions and analyzing results.
• Assists account teams in managing the customer account to enhance customer satisfaction and increase AMAT's product and technical reputation.
• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

Functional Knowledge

• Regarded as the technical expert in Wafer Advanced Packaging Technology
• Demonstrates in-depth expertise in Wafer Advanced Packaging Technology and broad knowledge of Advanced Packaging 2d, 2.5D and 3D packaging architectures.

Business Expertise

• Anticipates business and regulatory issues; recommends product, process or service improvements

Leadership

• Leads projects with notable risk and complexity; develops the strategy for project execution

Problem Solving

• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

Impact

• Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

• Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

Additional Information

Time Type: Full time

Employee Type: Assignee / Regular

Travel: Yes, 10% of the Time

Relocation Eligible: Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via email at Accommodations_Program@amat.com or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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